CIOE 2026 | Ligent Technologies Unveils Comprehensive AI Optical Interconnect Product Matrix, Featuring NPO/XPO and High‑Power Lasers
On September 7, Ligent Technologies, Inc., a world‑leading provider of optical solutions for AI infrastructure, announced that it will launch a new‑generation high‑speed optical interconnect product matrix and host multiple on‑site technical demonstrations during CIOE 2026. The event will fully showcase its latest R&D achievements covering high‑speed pluggable optical modules, NPO/XPO near‑packaged optics, external light sources, and system‑level optical interconnect architectures.
Driven by the evolving AI data centers, the industry faces brand‑new requirements for bandwidth density, power efficiency, optoelectronic integration capabilities and system architectures. Building on conventional high‑speed pluggable optical modules, Ligent Technologies has expanded its technical footprint to NPO/XPO near‑packaged optics and system‑level optical interconnect solutions. Multiple core products for next‑generation AI computing clusters are on full display at this exhibition.
For NPO (Near‑Packaged Optics), Ligent Technologies presents its 6.4T/3.2T NPO product series. The company takes an active part in formulating major industry standards including Open CPX, OIF NPO, ODCC UPO/SNPO and OAll Open NPO. By shortening high‑speed electrical interconnect distances, the product series effectively boosts system bandwidth density and cuts interconnect power consumption. Paired with the ELSFP external light source solution featuring self‑developed CW lasers, it delivers a complete NPO optical interconnect solution tailored for high‑density and low‑power‑consumption scenarios.
In terms of light source product lines, the 100 mW ELSFP has achieved initial commercialization, while the brand‑new 400 mW ultra‑high‑power ELSFP will be demonstrated on‑site at the exhibition. High‑power external light sources deliver sufficient optical power margin for new optoelectronic integration architectures such as NPO and CPO, helping systems optimize thermal management, reliability and maintainability.
Ultra‑high‑power lasers of 200 mW and above will be showcased at the venue. Ligent Technologies’ self‑developed lasers feature high output power, high efficiency and superior stability. They lay a solid light‑source foundation for ELSFP, NPO/CPO silicon photonics applications, completing the full technical chain spanning CW lasers, ELSFP external light sources down to NPO/CPO deployments.
Targeting liquid‑cooled AI deployment scenarios, Ligent Technologies releases the 12.8T XPO liquid‑cooled high‑density pluggable optical module. Adopting Thin‑Film Lithium Niobate (TFLN) modulation technology, this product delivers higher bandwidth density alongside lower interconnect power consumption, exploring next‑generation optical interconnect architectures that strike a balance among high density, heat dissipation performance and system maintainability.
In addition, multiple cutting‑edge technical solutions are presented on‑site: a 1.6T DR4 optical interconnect demonstration with 400G per wavelength, which validates device performance, signal integrity and link capabilities under 400G per‑wavelength rate, paving the way for future 3.2T and higher‑rate products; the 1.6T OSFP 2×LR4 long‑reach solution, which supports transmission distances up to 10 km leveraging LWDM technology to meet inter‑AI‑campus and cross‑data‑center interconnection demands; and the FAST OCS System optical switching solution. Combining high‑speed optical modules with silicon‑photonics/MEMS OCS technologies, it realizes microsecond‑level optical path switching and delivers end‑to‑end dynamic AI optical interconnection capabilities.
Forum Presentations During CIOE in September
“Joys and Challenges in the Optical Industry” — Dr. Huang Weiping, Founder of Ligent Technologies, 13:30, September 8, Xuntong Optical Communication Conference, Eaton Grand Ballroom, 2F, InterContinental Hotel, Shenzhen World Exhibition & Convention Center
“Key Technical Discussions on Short‑Reach Optical Interconnects” — Dr. Zhang Hua, Morning of September 10, Hall 9B, 2nd Floor, Hall 9, Shenzhen World Exhibition & Convention Center
Dr. Hong Jin, CEO of Ligent Technologies, commented: “Driven by AI infrastructure, competition for optical interconnects has shifted from standalone module performance toward collaborative optimization of chips, light sources, advanced packaging, optical engines and system architectures. Ligent Technologies keeps investing in high‑speed optical chips, silicon photonics, thin‑film lithium niobate, advanced packaging and next‑generation photonic integration technologies. Beyond high‑speed pluggable optical modules, we extend our reach to new optical interconnect architectures including ELSFP, NPO, XPO and OCS. Our goal is to continuously improve bandwidth density and reduce interconnect power consumption for AI infrastructure. Through collaborative innovation across devices, modules and systems, we provide customers with mass‑producible, scalable and customizable next‑generation optical interconnect solutions.”
Visit Ligent Technologies at Booth 13A56, Hall 13, Shenzhen World Exhibition & Convention Center during CIOE. Industry partners are warmly welcome for on‑site exchanges.