Company Profile

Ligent Technologies,Inc.(stock code:9856.hk) is a world‑class full‑stack supplier of optical communication and optical interconnection solutions. It is among the very few optical communication enterprises globally with in‑house R&D and mass‑production capabilities for both AI‑interconnect optical chips and high‑speed optical modules. With over two decades of in‑depth engagement in the optical communications industry, the company has built a business portfolio spanning optical chips, high‑speed optical modules and optical network terminals. Its high‑speed optical interconnect product lineup keeps evolving from 800G and 1.6T to 3.2T, while active R&D initiatives are underway for next‑generation AI optical interconnection technologies including NPO, CPO and XPO. Leveraging the synergistic R&D of optical chips and modules, its global R&D‑and‑manufacturing footprint and worldwide customer base, the company steadily strengthens its capacity for technological innovation, product iteration and global delivery supporting AI computing infrastructure.

Ligent Technologies,Inc. stands as a pioneer driving technological innovation and breakthroughs in the optical communications sector. It is one of China’s first manufacturers to develop and mass‑produce 10G EML laser chips, one of China’s first vendors to roll out 800G and 1.6T optical modules in volume, and one of the world’s first suppliers to commercialize 50G PON optical modules. According to Frost & Sullivan reports, in 2025, the company ranked 5th globally and 3rd in China by revenue among dedicated optical‑module manufacturers, and took the 2nd spot worldwide in the optical network terminal segment. In 2025, Ligent Technologies,Inc. recorded revenue exceeding RMB 8.355 billion. Its core business mix has undergone marked optimisation: revenue contribution from datacom optical modules surged from 24.9% in 2023 to 69.4% in the first half of 2026, marking a strategic transformation from a conventional telecom optical‑module supplier to a core provider for AI computing infrastructure. Having been listed on the Main Board of the Hong Kong Stock Exchange in September 2026, Ligent Technologies,Inc. will build upon this milestone to further scale up high‑end optical chip development, 3.2T and next‑generation optical‑interconnect technologies as well as global production capacity, and accelerate its journey to become a globally leading AI optical‑interconnect platform enterprise.

LIGENT has built a comprehensive product portfolio that spans the entire value chain of the optical-communication industry, generating strong synergies across its product lines.